Heating tube for semiconductor-making furnace



FIG. 1 is a front elevational view of a first embodiment of a heatingtube for semiconductor-making furnace showing my new design;

FIG. 2 is a rear elevational view thereof;

FIG. 3 is a left-side elevational view thereof;

FIG. 4 is a right-side elevational view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a sectional view on line 7—7 in FIG. 3;

FIG. 8 is a front elevational view of a second embodiment of the heatingtube for semiconductor-making furance;

FIG. 9 is a rear elevational view thereof;

FIG. 10 is a left-side elevational view thereof;

FIG. 11 is a right-side elevational view thereof;

FIG. 12 is a top plan view thereof;

FIG. 13 is a bottom plan view thereof; and,

FIG. 14 is a sectional view on line 14—14 in FIG. 10.

The broken lines are for illustrative purposes only and form no part ofthe claimed design.

I claim the ornamental design for heating tube for semiconductor-makingfurnace, as shown and described.